Materials for forming composite packages and method of...

Details Materials for forming composite packages and method of... Materials for forming composite packages and method of...

B - Operations, Transporting

65

D

220/1, 93/62

B65D 30/02 (2006.01) B65D 33/14 (2006.01) B65D 77/24 (2006.01)

Patent

CA 1139720

D-7073CN MATERIALS FOR FORMING COMPOSITE PACKAGES AND METHOD OF PRODUCING SUCH PACKAGES ABSTRACT The invention relates to materials and method for forming composite packages comprising a first flexible material (11) and a second relatively rigid material (12) which are connected together without the use of additional connecting materials. The connection is achieved by causing the flexible material (11) to be deformed to cooperate in tension with interrupted zones (19) of the relatively rigid material (12). Many different packages may be formed for a variety of uses but the invention is particularly suitable for connecting a heat shrinkable plastics body part to a paperboard or like sheet material end part.

347275

Affiliated with

Also associated with

Rating

Materials for forming composite packages and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Materials for forming composite packages and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Materials for forming composite packages and method of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-389549