Materials for use in forming, electronic interconnect

Details Materials for use in forming, electronic interconnect Materials for use in forming, electronic interconnect

B - Operations, Transporting

32

B

154/100, 154/134

B32B 27/10 (2006.01) B23K 35/02 (2006.01) H05K 3/20 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1269603

Abstract of the Disclosure This invention provides a device for placing elongate joint-forming preforms such as solder columns on electronic components such as chip carriers using a water soluble retaining member which positions and holds the preforms while they are attached to the electronic component. The retaining member is then dissolved in hot or cold water. The retaining member is constructed of water soluble or water dispersible paper in combination with coatings of or layers of a water soluble material such as polyethyleneoxide. The water soluble retaining member can be a laminate of alter- nating layers of water soluble paper and water soluble polymeric material.

522578

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