Materials for use with interconnects of electrical devices...

Details Materials for use with interconnects of electrical devices... Materials for use with interconnects of electrical devices...

B - Operations, Transporting

23

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B23K 1/00 (2006.01) H01L 33/62 (2010.01) B23K 31/02 (2006.01) B23K 35/00 (2006.01) H01B 1/02 (2006.01) H01R 4/02 (2006.01) H05K 3/32 (2006.01)

Patent

CA 2666363

Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.

Certains exemples présentés dans les présentes ont trait à des matériaux qui sont conçus pour une utilisation dans des interconnexions de dispositifs électriques tels que, par exemple, des cartes de circuit imprimés et des piles solaires. Dans certains exemples, une brasure tendre en deux étapes peut être utilisée pour réduire les contraintes sur les matériaux utilisés dans la production des dispositifs électriques.

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