Matrix electronic devices using opaque substrates and...

Details Matrix electronic devices using opaque substrates and... Matrix electronic devices using opaque substrates and...

H - Electricity

01

L

H01L 21/70 (2006.01) H01L 21/461 (2006.01) H01L 21/77 (2006.01) H01L 27/15 (2006.01) H01L 29/12 (2006.01) H01L 49/02 (2006.01)

Patent

CA 2682360

A fabrication method is described for forming an electronic circuit on a flexible substrate consisting of plastic and opaque foils. Corresponding circuit structures are also described herein. The opaque substrate can be selected from a set of polymers which have the appropriate thermo-mechanical properties. The foil geometry of the opaque substrate can be selected to maximize the structural integrity on the display in the planar directions but have excellent mechanical stress distribution when bent or flexed.

Le procédé de fabrication ci décrit permet de former un circuit électronique sur un substrat flexible constitué de feuilles de matières plastiques et opaques. Des structures de circuit correspondantes sont également décrites dans le présent document. Le substrat opaque peut être choisi parmi un ensemble de polymères qui ont les propriétés thermomécaniques appropriées. La géométrie en feuille du substrat opaque peut être choisie pour rendre maximale l'intégrité structurale sur l'affichage dans les directions en plan mais possède une excellente distribution de contrainte mécanique, courbé ou fléchi.

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