Mechanical acceleration multiplier for microcircuit bond...

Details Mechanical acceleration multiplier for microcircuit bond... Mechanical acceleration multiplier for microcircuit bond...

G - Physics

01

N

73/85

G01N 19/04 (2006.01)

Patent

CA 1113274

ABSTRACT OF THE DISCLOSURE A mechanical acceleration multiplier for testing the bond strength of an adhesive wherein the adhesive to be tested is subjected to a centrifugal force.

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