Mechanical deformation amount sensor

G - Physics – 01 – B

Patent

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Details

G01B 7/16 (2006.01) B60J 7/057 (2006.01) G01L 9/00 (2006.01) G01P 15/12 (2006.01)

Patent

CA 2430451

A mechanical deformation amount sensor includes a sensor structure which is formed by a semiconductor substrate or an insulating substrate. The sensor integrally includes a deformation portion deformable when a physical quantity to be detected is applied to the sensor structure. The sensor also includes a support portion for supporting the deformation portion, a carbon nanotube resistance element disposed on the deformation portion so as to be mechanically deformed in response to deformation of the deformation portion and a wiring pattern which is formed in a pattern on the sensor structure so as to be connected to the carbon nanotube resistance element. By applying a voltage to the carbon nanotube resistance element via the wiring pattern, a change of electrical conductivity of the carbon nanotube resistance element upon mechanical deformation of the carbon nanotube resistance element is transduced in an electrical signal.

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