Mechanical patterning of a device layer

Details Mechanical patterning of a device layer Mechanical patterning of a device layer

H - Electricity

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H01L 21/027 (2006.01) B81C 1/00 (2006.01) H01L 21/308 (2006.01) H01L 21/311 (2006.01) H01L 21/321 (2006.01) H01L 27/32 (2006.01) H01L 51/52 (2006.01)

Patent

CA 2343227

A method of fabricating a device comprising mechanically patterning a device layer using a stamp containing the desired pattern. The device layer is formed on a plastic or polymeric substrate. The stamp is pressed against the substrate under a load which patterns the device layer without cracking it in the non-patterned areas.

L'invention concerne un procédé de fabrication d'un dispositif, qui consiste à imprimer mécaniquement un motif sur une couche du dispositif au moyen d'un tampon comportant le motif désiré. La couche du dispositif est formée sur un substrat plastique ou polymérique. Le tampon est pressé contre le substrat sous le poids d'une presse qui imprime le motif sur la couche du dispositif sans la fissurer dans les zones non imprimées.

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