B - Operations – Transporting – 27 – N
Patent
B - Operations, Transporting
27
N
B27N 3/08 (2006.01) B27N 1/00 (2006.01) B27N 1/02 (2006.01)
Patent
CA 2416817
The invention relates to a method of manufacture as well as associated apparatus for a board made of fibres or chip as well as a board made by the method. The invention relates in particular to MDF- or HDF- or chip boards. The aim of the invention is the provision of a board with a smaller proportion of glue in comparison with the state of the art. To solve the problem of the invention the fibres or chips are in particular first dried and then glue is mixed with the dried fibres or chips at temperatures lying substantially below the drying temperatures and in fact in particular below 100°C. In this way one avoids the glue being undesirably exposed to the relatively high temperatures which arise during the drying. The result is a board having a relatively low proportion of glue.
L'invention se rapporte à un procédé et à un dispositif correspondant conçus pour produire des panneaux de fibres ou de copeaux, ainsi qu'à un panneau produit selon ledit procédé. L'invention concerne plus précisément des panneaux de copeaux MDF ou HDF. L'objectif de l'invention est de concevoir un panneau présentant une proportion de colle inférieure à celle d'un panneau selon l'art antérieur. A cet effet, les fibres ou les copeaux sont tout d'abord séchés. De la colle est ensuite mélangée aux fibres ou aux copeaux séchés, et ceci à des températures sensiblement inférieures aux températures de séchage et plus particulièrement inférieures à 100 DEG C. Ceci permet d'éviter que la colle ne soit indésirablement exposée à des températures relativement élevées telles que lors du séchage. Le panneau obtenu présente une proportion de colle relativement réduite.
Kronospan Technical Company Ltd.
Shapiro Cohen
LandOfFree
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