Mechanically joined sputtering target and adapter therefor

Details Mechanically joined sputtering target and adapter therefor Mechanically joined sputtering target and adapter therefor

C - Chemistry, Metallurgy

23

C

C23C 14/34 (2006.01) H01J 37/317 (2006.01)

Patent

CA 2213073

A target assembly in which the sputtering material is not soldered or otherwise metallurgically bonded to a backing plate (20). Rather, the target (30), which is homogeneously manufactured of sputtering material, is mechanically coupled (e.g., with bolts (45)) to an adapter (32), which is itself permanently affixed to the chamber (10). As a result, the target can be easily uncoupled from the chamber and replaced, without also requiring removal and replacement of a backing plate.

L'invention concerne un ensemble cible dans lequel le matériau à pulvériser n'est pas soudé ou autrement fixé par voie métallurgique à une plaque de support (20). Par contre, la cible (30), qui est homogène et réalisée en un matériau de pulvérisation, est accouplée mécaniquement (par exemple par des boulons (45)) à un adaptateur (32), qui est lui-même fixé à demeure à la chambre (10). Dans ces conditions, la cible peut facilement être détachée de la chambre et remplacée, sans qu'il soit nécessaire d'enlever et de remplacer également la plaque de support.

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