Mechanically polishing semi-conductor wafers with silica...

Details Mechanically polishing semi-conductor wafers with silica... Mechanically polishing semi-conductor wafers with silica...

B - Operations, Transporting

01

J

57/22, 134/51

B01J 13/00 (2006.01) B28D 5/00 (2006.01)

Patent

CA 1151500

ABSTRACT OF THE DISCLOSURE An improved polishing product and improved results in mechanically polishing semi-conductor wafers such as silicon, sapphire, and gadolinium- gallium-garnets (GGG wafers) is provided by the preparation and use of a special type of mono-dispersed, high surface density particle silica sol prepared by a special process.

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