Melt-fusible polyimides

Details Melt-fusible polyimides Melt-fusible polyimides

C - Chemistry, Metallurgy

08

G

402/221, 402/33,

C08G 73/10 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1268593

TITLE MELT-FUSIBLE COPOLYIMIDES ABSTRACT Melt-fusible copolyimides based on pyromellitic anhydride and two defined classes of aromatic diamines, at least one diamine of each class being incorporated into the polyimide, each diamine class being present in an amount of 10-90 mole percent of the total diamine content (100 mole percent), melt below about 400°C and can be fabricated into articles, or can be applied to either fibrous or nonfibrous substrates to make prepregs, tapes, etc., which then are shaped into final articles, such as printed circuit boards or aircraft panels.

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