C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4601, 400/53
C08L 77/00 (2006.01) C08K 5/54 (2006.01)
Patent
CA 1263984
Abstract of the Disclosure The present invention relates to polyamide resin compositions con- sisting of 100 parts by weight of a polyamide containing tetramethylene adip- amide as main component and 0.01 to 3 parts by weight of an aminosilane, epoxysilane or vinylsilane. The resin compositions display high melt stability.
495746
Chiba Kazumasa
Fetherstonhaugh & Co.
Stamicarbon B.v. (licensing Subsidiary Of Dsm)
LandOfFree
Melt-stable poly-tetramethylene adipamides does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Melt-stable poly-tetramethylene adipamides, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Melt-stable poly-tetramethylene adipamides will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1205683