Melt-stable poly-tetramethylene adipamides

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/4601, 400/53

C08L 77/00 (2006.01) C08K 5/54 (2006.01)

Patent

CA 1263984

Abstract of the Disclosure The present invention relates to polyamide resin compositions con- sisting of 100 parts by weight of a polyamide containing tetramethylene adip- amide as main component and 0.01 to 3 parts by weight of an aminosilane, epoxysilane or vinylsilane. The resin compositions display high melt stability.

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