Mesa undercutting semiconductor fabrication technique

Details Mesa undercutting semiconductor fabrication technique Mesa undercutting semiconductor fabrication technique

H - Electricity

01

L

356/177

H01L 21/00 (2006.01) H01L 21/306 (2006.01) H01L 21/76 (2006.01) H01L 21/764 (2006.01) H01S 5/227 (2006.01) H01L 33/00 (2006.01)

Patent

CA 1321268

ABSTRACT OF THE DISCLOSURE A method of undercutting mesa structures in which the lateral extent of the undercut is determined by a prior fabrication stage in which channels (5, 6) are etched and then infilled with a different material. The mesa is formed over the channels (5, 6) and a selective etch is used to undercut the mesa, the extent of the undercut (11) being limited by the location of the infilled channels (5, 6). For mechanical stability and insulation the undercuts (11) are filled or partly filled with dielectric (10).

543197

Affiliated with

Also associated with

Rating

Mesa undercutting semiconductor fabrication technique does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mesa undercutting semiconductor fabrication technique, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mesa undercutting semiconductor fabrication technique will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1176801