Metal bonded diamond aggregate abrasive

Details Metal bonded diamond aggregate abrasive Metal bonded diamond aggregate abrasive

C - Chemistry, Metallurgy

09

K

57/16

C09K 3/14 (2006.01) B24D 3/00 (2006.01) B24D 3/06 (2006.01) B24D 3/34 (2006.01) C22C 26/00 (2006.01)

Patent

CA 1179849

60SD-164 IMPROVED METAL BONDED DIAMOND AGGREGATE ABRASIVE ABSTRACT OF THE DISCLOSURE An improved diamond aggregate abrasive is disclosed comprising milled saw diamond having an average size less than 75 microns held in a silver/ copper alloy matrix which also contains a wetting agent fro (e.g. titanium). Tests of grinding wheels containing this new aggregate have shown a marked improvement in grinding ratio over commercially available diamond aggregates.

408518

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