H - Electricity – 05 – K
Patent
H - Electricity
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K
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H05K 1/02 (2006.01) B32B 15/08 (2006.01) H01L 23/14 (2006.01) H05K 1/05 (2006.01) H05K 3/00 (2006.01) H05K 1/09 (2006.01) H05K 3/02 (2006.01)
Patent
CA 1232971
ABSTRACT OF THE DISCLOSURE It is disclosed that a metal cored board which com- prises a base metal core, an easily solderable metal plating layer formed on one surface of the base metal core, an electrically insulating layer formed on the another surface of the base metal core, and an electrically conductive metal layer formed on the electrically insu- lating layer, a method for manufacturing a metal cored board, which comprises a step to plate both surface of a base metal core with an easily solderable metal, a step to form an electrically insulating layer on one surface of the easily solderable metal plating layer, and a step to form an electrically conductive metal layer on the electrically insulating layer.
487695
Chiba Kimio
Hirose Michio
Ishibashi Hiroshi
Ishii Akihiro
Itoh Hirotaka
Gowling Lafleur Henderson Llp
Mitsubishi Cable Industries Ltd.
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