Metal cored circuit board with baked-on polymer layer

Details Metal cored circuit board with baked-on polymer layer Metal cored circuit board with baked-on polymer layer

H - Electricity

05

K

337/66, 356/9

H05K 1/02 (2006.01) H01L 21/58 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1240072

ABSTRACT OF THE DISCLOSURE It is disclosed that a metal cored board which com- prises an electrically conductive layer whose one surface at least composed of a hardly oxidizable metal, an insu- lating organic polymer layer baked on the surface of the hardly oxidizable metal, and a metal core adhered on the insulating organic polymer layer, and a method for manufacturing a metal cored board, which comprises a step to coat the surface of a hardly oxidizable metal layer of an electrically conductive metal foil with an insulating varnish, a step to bake a layer of the varnish, and a step to adhere a metal core on the baked varnish layer.

487703

Affiliated with

Also associated with

Rating

Metal cored circuit board with baked-on polymer layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal cored circuit board with baked-on polymer layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal cored circuit board with baked-on polymer layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1299638