Metal deposition from a non-autocatalytic electroless...

Details Metal deposition from a non-autocatalytic electroless... Metal deposition from a non-autocatalytic electroless...

C - Chemistry, Metallurgy

25

D

204/18

C25D 3/38 (2006.01) C23C 18/52 (2006.01) C25D 5/00 (2006.01) C25D 5/54 (2006.01) H05K 3/24 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1177773

ABSTRACT OF THE DISCLOSURE A method of continuously depositing a metallic plating to any desired thickness on the surface of a workpiece from a non-autocatalytic electroless plating bath that is normally inherently self-limiting as to the thickness of metal which can be deposited by electrolessly plating, the novel method comprising applying an electric potential on the workpiece in the electroless bath. The method provides non-autocatalytic baths, such as hypophosphite-reduced electroless copper baths, with the ability to plate on nonconductors to a thickness which increases with time at a rate dependent on the amount of current applied. A more uniform thickness of deposit over the workpiece being plated and greater deposit penetration into blind holes, deep recesses and tubular portions of complex-shaped parts are obtainable by the method.

383621

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