C - Chemistry – Metallurgy – 23 – F
Patent
C - Chemistry, Metallurgy
23
F
149/23
C23F 1/02 (2006.01) C09K 13/06 (2006.01) C23F 1/16 (2006.01)
Patent
CA 1115627
DISSOLUTION OF METALS ABSTRACT Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and an effective amount of a mono- or dihydroxy-substituted cyclo- paraffin. The present invention relates to the dissolution of metals in an aqueous bath containing sulfuric acid and hydrogen peroxide, and in particular to a novel bath composition capable of effecting the dissolution at high rates. In one specific aspect the invention is concerned with etching of copper in the production of printed circuit boards, -1-
311827
Elias Moenes L.
Readio Philip D.
Dart Industries Inc.
Gowling Lafleur Henderson Llp
LandOfFree
Metal-dissolution solution containing sulfuric acid,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Metal-dissolution solution containing sulfuric acid,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal-dissolution solution containing sulfuric acid,... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-304590