Metal-dissolution solution containing sulfuric acid,...

C - Chemistry – Metallurgy – 23 – F

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149/23

C23F 1/02 (2006.01) C09K 13/06 (2006.01) C23F 1/16 (2006.01)

Patent

CA 1115627

DISSOLUTION OF METALS ABSTRACT Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and an effective amount of a mono- or dihydroxy-substituted cyclo- paraffin. The present invention relates to the dissolution of metals in an aqueous bath containing sulfuric acid and hydrogen peroxide, and in particular to a novel bath composition capable of effecting the dissolution at high rates. In one specific aspect the invention is concerned with etching of copper in the production of printed circuit boards, -1-

311827

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