H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/143
H01L 23/20 (2006.01)
Patent
CA 1304172
ABSTRACT OF THE DISCLOSURE A process for assembling a package contain- ing an enclosure to house an electronic device, includes the steps of providing an electrically conductive lead- frame. The leadframe has first and second surfaces and is comprised of a plurality of lead fingers dis- posed about a centrally positioned die attach pad. The electronic device is bonded to the die attach pad and is electrically connected to the leads. The pro- cess also includes the steps of providing a first, second and third bonding means, providing a base com- ponent and providing a cover component. The base component is bonded to the first surface of the lead- frame with the first bonding means and at essentially the same time the base component is bonded to the die attach pad with the third bonding means. The cover component is bonded to the second surface of the lead- frame with the second bonding means.
613142
Butt Sheldon H.
Crane Jacob
Mahulikar Deepak
Pasqualoni Anthony M.
Smith Edward F. III
Olin Corporation
Swabey Ogilvy Renault
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