Metal electronic package with reduced seal width

Details Metal electronic package with reduced seal width Metal electronic package with reduced seal width

H - Electricity

01

L

H01L 23/02 (2006.01) H01L 23/043 (2006.01) H01L 23/057 (2006.01) H01L 23/10 (2006.01) H01L 23/18 (2006.01) H01L 23/24 (2006.01) H01L 23/28 (2006.01) H01L 23/495 (2006.01) H05K 5/06 (2006.01)

Patent

CA 2145076

There is provided an electronic package (30) where the package components (12, 14) define a cavity (24). A semiconductor device (16) and a portion (18) of a leadframe (20) occupy part of the cavity (24). Substantially the remainder of the cavity (24) is filled with a compliant polymer (26), such as a silicone gel. Since the cavity (24) is no longer susceptible to gross leak failure, the seal width (RW) of adhesives (22) used to assemble the package (30) may be reduced, thereby increasing the area available for mounting the semiconductor device (16).

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