C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 163/02 (2006.01) B32B 7/12 (2006.01) C09J 11/04 (2006.01) C09J 109/02 (2006.01) C09J 163/00 (2006.01) C09J 179/04 (2006.01)
Patent
CA 2188345
A family of adhesives is provided for bonding cyanate ester composite articles to- gether which is also plateable with metal once chemically etched. The adhesives comprise a polymeric matrix and a filler of metal powder or metal flakes. The polymeric matrix com- prises at least one polyepoxide resin and a curing agent. In practice, the present adhesive is applied to the surface of cyanate ester composite articles to be bonded and is allowed to cure at room temperature. Thereafter, the surface of the assembly is chemically etched and then plated with metal. The present adhesives enable the complete coverage of the cyanate ester composite assembly with the plated metal, including the adhesive bondlines. A cyanate ester resin structure assembled with the present adhesive composition may, upon plating, replace certain metallic components in such applications as aircraft, spacecraft, and auto- mobiles given its highly conductive and comprehensive metallic coating.
Elias William E.
Punsly Brian M.
Wallace Andre R.
He Holdings Inc.
Hughes Electronics Corporation
Sim & Mcburney
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