Metal-film laminate resistant to delamination

Details Metal-film laminate resistant to delamination Metal-film laminate resistant to delamination

B - Operations, Transporting

32

B

B32B 15/08 (2006.01) C23C 4/10 (2006.01) C23C 14/02 (2006.01) C23C 14/08 (2006.01) C23C 14/20 (2006.01) C23C 16/06 (2006.01) H05K 3/06 (2006.01) H05K 3/38 (2006.01) H05K 1/00 (2006.01)

Patent

CA 2051266

Abstract A flexible metal-film laminate can comprise a layered film structure having a metal layer securely bonded to a film layer. The laminate contains a unique metal-oxide attachment structure between the film and metal layer comprising randomly distributed regions of metal-oxide. The peel strength of such a laminate is significantly improved over prior laminates and is resistant to peel strength reduction due to environmental stress. The preferred metal-film laminates made with polyester or polyimide can be used in the manufacture of high-quality, low cost, flexible printed circuit boards.

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