Metal finishing process

B - Operations – Transporting – 32 – B

Patent

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Details

B32B 15/08 (2006.01) B05D 7/00 (2006.01) C25D 5/10 (2006.01) C25D 5/48 (2006.01)

Patent

CA 2194674

A finishing process for a base metal substrate comprising the steps of polishing the surface of the base metal substrate, electroplating the metal substrate with copper, electroplating a layer of metal over the copper plate, and depositing a substantially moisture impervious coating on the metal layer.

Traitement de la surface d'un substrat à base de métal comprenant les étapes consistant à polir la surface dudit substrat, à électroplaquer ce substrat avec du cuivre, à électroplaquer une couche de métal sur le placage de cuivre et à déposer un revêtement sensiblement imperméable à la vapeur d'eau sur la couche de métal.

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