Metal foil with a structure surface

Details Metal foil with a structure surface Metal foil with a structure surface

H - Electricity

05

K

H05K 1/09 (2006.01) B29C 37/00 (2006.01) B32B 15/08 (2006.01) C23F 1/02 (2006.01) G03F 7/26 (2006.01) H05K 3/38 (2006.01) H05K 3/44 (2006.01) H05K 1/05 (2006.01) H05K 3/06 (2006.01)

Patent

CA 2063503

ABSTRACT OF DISCLOSURE METAL FOIL WITH A STRUCTURED SURFACE The surface of a metal foil as used as an intermediate layer in printedcircuit boards is photochemically roughened. The partial steps are based on standard process steps. Fine depressions are etched out of the metal coating or protuberances are plated thereon. The use of the method or the use of the foil in the production of multilayer prin- ted circuit boards with coatings having different thermal expansion characteristics improves the adhesion with the next conductor layer applied thereto to a significant extent and prevents delamination.

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