C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 5/10 (2006.01) C25D 1/04 (2006.01) C25D 5/16 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2070046
GOUL-FL-145-200 Title: METAL FOIL WITH IMPROVED BONDING TO SUBSTRATES AND METHOD FOR MAKING SAID FOIL ABSTRACT OF THE DISCLOSURE A metallic foil with improved bonding to sub- strates is disclosed which has on a surface thereof three superimposed electrodeposited layers, the first layer adjacent to said surface comprising a dendritic deposit comprising a major amount of a first metal, the second layer comprising a metal flash uniformly deposited over said first layer comprising a major amount of a second metal other than said first metal, and a third layer comprising a dendritic deposit comprising a major amount of a metal other than said first metal. A method for making such foil is disclosed which comprises (A) electrodeposit- ing a dendritic deposit comprising a major amount of a first metal on one surface of said foil; (B) electrode- positing over the dendritic deposit of (A) a metal flash comprising a major amount of a second metal other than said first metal of (A); and (C) electrodepositing on said metal flash of (B) a dendritic deposit of a metal layer compris- ing a major amount of a metal other than said first metal of (A). The improved foil is useful for a wide range of applications that benefit from the improved bonding to substrates, including electronic devices such as printed circuit boards and solid state switches.
Sadey Richard J.
Zatt Dennis M.
Gould Inc.
Gould Electronics Inc.
Ridout & Maybee Llp
Sadey Richard J.
Zatt Dennis M.
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