Metal material bonding method

Details Metal material bonding method Metal material bonding method

B - Operations, Transporting

23

K

B23K 13/01 (2006.01) B23K 1/00 (2006.01) B23K 1/002 (2006.01) B23K 11/00 (2006.01) B23K 20/16 (2006.01)

Patent

CA 2261446

In a metal material bonding method, an insertion material, which has a lower melting point than that of metal materials to be bonded, is interposed between bonding end surfaces of the metal materials to be bonded. The metal materials to be bonded is heated and held to a temperature not lower than the melting point of the insertion material and not higher than the melting point of the metal materials to be bonded while applying pressure to bonding surfaces of the metal materials to be bonded. The insertion material is formed to have a size which is smaller than each of the bonding surfaces of the metal materials to be bonded.

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