Metal mold with extended heat transfer surface

Details Metal mold with extended heat transfer surface Metal mold with extended heat transfer surface

B - Operations, Transporting

29

C

B29C 33/02 (2006.01) B29C 33/04 (2006.01) B29C 39/26 (2006.01) B29C 39/38 (2006.01) F28F 1/12 (2006.01)

Patent

CA 2043983

A mold assembly for molding thermoplastic particles into a solid thin shell includes a metal shell having a cavity and including an outer surface exposed to a heat source and further including an inner surface on which thermoplastic material is cast and fused to form a thin layer thermoplastic shell. The heat transfer area of the metal shell is increased by providing a plurality of heat transfer pins connected to the outer surface: each of the heat transfer pins has an extended outside surface area exposed to the heat source for heating said metal shell and each of said heat transfer pins further includes a large diameter head portion which is joined to the metal shell by a capacitive weld nugget formed solely between the large diameter head portion and the outer surface of the metal shell without disrupting the metal shell at surface portions thereof formed between the heat transfer pins.

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