Metal nanoparticle composition with improved adhesion

Details Metal nanoparticle composition with improved adhesion Metal nanoparticle composition with improved adhesion

C - Chemistry, Metallurgy

09

D

C09D 5/24 (2006.01) B82Y 30/00 (2011.01) B05D 1/00 (2006.01) B22F 1/00 (2006.01) C09D 1/00 (2006.01) H01B 1/20 (2006.01) H01L 21/288 (2006.01) H01L 21/445 (2006.01) H05K 3/10 (2006.01)

Patent

CA 2695854

A composition that may be used for an electronic circuit element includes a metal nanoparticle, an adhesion promoter compound and a solvent. The adhesion promoter compound may be a hydrolytic silane with at least one organic functional moiety. A method of forming conductive features on a substrate includes depositing a composition containing metal nanoparticles, an adhesion promoter compound and a solvent onto a substrate, and heating the deposited composition to a temperature from about 100°C to about 200°C.

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