Metal pattern formation

Details Metal pattern formation Metal pattern formation

H - Electricity

01

L

H01L 21/3213 (2006.01) G03F 1/00 (2006.01) H05K 3/06 (2006.01) H05K 3/24 (2006.01) H05K 3/00 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2435755

A method of reproducibly manufacturing circuit carriers with very fine circuit structures and an electrophoretic varnish to be applied in this method are described in which a dielectric substrate comprising a base metal surface is provide, a varnish layer is applied onto the substrate surface electrodepositing the electrophoretic varnish, thereafter the varnish layer is ablated in at least parts of the regions that do not correspond to the metal pattern to be formed by means of ultraviolet radiation, the base metal surface being laid bare, and finally the bare base metal surface is etched.

L'invention concerne un procédé de fabrication reproductible de support de circuit présentant de très fines structures de circuit et un vernis électrophorétique destiné à être appliqué selon ce procédé. Le procédé consiste à utiliser un substrat diélectrique comprenant une surface métallique de base, à appliquer une couche de vernis sur la surface du substrat, par électrodéposition du vernis électrophorétique, puis à procéder à l'ablation de la couche de vernis dans au moins certaines parties des régions ne correspondant pas au motif métallique devant être formé par rayonnement ultraviolet, la surface métallique de base étant dénudée, et consistant enfin à graver la surface métallique de base dénudée.

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