Metal plating solution

Details Metal plating solution Metal plating solution

C - Chemistry, Metallurgy

23

C

6/4

C23C 18/36 (2006.01) C23C 18/40 (2006.01) C23C 18/52 (2006.01)

Patent

CA 1051606

METAL PLATING SOLUTION Abstract of the Disclosure An electroless metal plating solution is characterized by an elemental sulfur stabilizer, either in colloidal or soluble, non-ionic form. Elemental sulfur as a stabilizer is an improve- ment over prior art stabilizers as it can be used in substantially larger concentration than prior art divalent sulfur stabilizers which are catalytic poisons.

238933

Affiliated with

Also associated with

Rating

Metal plating solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal plating solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal plating solution will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1114764