C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
C22C 9/00 (2006.01) B22F 1/00 (2006.01) C04B 41/51 (2006.01) C04B 41/52 (2006.01) C04B 41/88 (2006.01) C04B 41/89 (2006.01) C22C 1/04 (2006.01) C23C 24/08 (2006.01) H01L 21/48 (2006.01) H05K 1/09 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2123905
A metal powder composition for metallization is for use in forming a metallized film from a paste comprising Cu and Ti powder and essentially consists of 95 to 99.5% Cu and 0.5 to 5% Ti in weight ratio. The above-mentioned paste is applied onto a substrate and then fired to provide a metallized substrate.
L'invention concerne une composition de poudre métallique pour la métallisation, utilisée pour former un revêtement métallique à partir d'une pâte comprenant une poudre de cuivre et de titane, ladite composition contenant 95 à 99,5 % en poids de cuivre et 0,5 à 5 % en poids de titane. Pour métalliser un substrat, on applique sur celui-ci une couche de pâte, puis on le fait sécher au four.
Iwata Shinichi
Ohno Tomeji
Watabe Youhei
Dennison Associates
Nec Tokin Corporation
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