B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
18/1106
B29C 39/02 (2006.01) B29C 33/38 (2006.01) B29C 39/10 (2006.01) B29C 70/58 (2006.01) B29C 70/64 (2006.01) C08K 3/08 (2006.01)
Patent
CA 2022642
In order to increase the performance of a mold of thermosetting resin, metal powder is dispersed in the resin mold which has a dense and voidless structure. The mold may be mounted on a back-up member of metal. In this case, the bonding between the mold and the back- up member is much assured when metal balls are contained in the mold near the back-up member. Furthermore, the mold may be electrically metal-plated. In this case, the mold is coated with a condutive plastic paint before being subjected to the electric metal plating in an electrolytic solution.
Ishimura Hidekazu
Nomura Hideo
Takagi Isao
Yamaguchi Nobuyuki
Asahi Kasei Chemicals Corporation
Ishimura Hidekazu
Nissan Motor Co. Ltd.
Nomura Hideo
Robic
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