Metal stripping composition and process

C - Chemistry – Metallurgy – 23 – F

Patent

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C23F 1/30 (2006.01) B23K 35/36 (2006.01) C23F 1/44 (2006.01) H05K 3/06 (2006.01)

Patent

CA 1196560

ABSTRACT OF THE DISCLOSURE There is disclosed a chemical stripping solution suitable for removing tin and tin-lead alloys from metallized, e.g. copper coated, substrates so as to leave the substrate reusable, comprising an aqueous solution of hydrogen peroxide in an amount of 0.1 to 10 molar, ammonium bifluoride or ammonium fluoride in an amount of 0.4 to 10 molar, an acid in an amount such as to maintain the pH of the solution at the surface being stripped below the value at which smut formation occurs whereby effective stripping is achieved in use, and a metal complexing compound in an amount of at least 0.005 molar. The metal complexing compound comprises an 8-hydroxyquinoline compound and the molar ratio of hydrogen ions to complexing compound is at least 100:1.

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