Metalized substrate having a thin film barrier layer

Details Metalized substrate having a thin film barrier layer Metalized substrate having a thin film barrier layer

H - Electricity

05

K

356/12

H05K 3/10 (2006.01) C25D 5/54 (2006.01) H01L 23/15 (2006.01) H01L 27/01 (2006.01) H05K 3/38 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1103811

A METALIZED SUBSTRATE HAVING A THIN FILM BARRIER LAYER ABSTRACT A method of fabricating a hybrid circuit including a siliceous substrate and thick metal conductors. A thin film barrier layer is provided intermediate the substrate and a vacuum-deposited metal layer, which metal layer is subsequently electroplated to provide the desired metal thickness. The barrier layer, which may suitably be a refractory metal oxide such as the oxides of zirconium, tantalum, titanium, or tungsten, prevents loss of adhesion between the vacuum deposited metal and substrate that occurs during electroplating.

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