Metalized substrates and process for producing

Details Metalized substrates and process for producing Metalized substrates and process for producing

B - Operations, Transporting

05

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356/12, 204/18,

B05D 5/12 (2006.01) B05D 1/32 (2006.01) C03C 17/40 (2006.01) C04B 41/51 (2006.01) C04B 41/88 (2006.01) C25D 5/02 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1259528

ABSTRACT The present invention is directed to metallized substrates and particularly metallized substrates for use in microwave integrated circuits and a process for producing such substrates. The metallized substrates generally comprise a dielectric substrate on which is formed a pattern such as a conductor line pattern, the pattern being formed of a conductive metal. The metallization is accomplished by forming one or more adhesion layers from a metallo organic composition which is built up with a metal conductor.

546441

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