Metallic laminations for magnetic circuits

Details Metallic laminations for magnetic circuits Metallic laminations for magnetic circuits

H - Electricity

01

F

H01F 3/02 (2006.01) H02K 1/06 (2006.01)

Patent

CA 2504837

Metallic laminations for magnetic circuits. Some of the illustrative embodiments may be a magnetic circuit comprising a low reluctance magnetic flux path comprising a plurality of stacked metallic laminations (each lamination having an edge), and an air gap in operational relationship to at least a portion of the edges of the stacked metallic laminations (wherein magnetic flux flows at least partially through the stacked metallic laminations and the air gap). Adjacent edges of the stacked metallic laminations are intentionally offset by an amount greater than manufacturing tolerance of edge position for the stacked metallic laminations to improve eddy current loss occurring from lamination-to-lamination contact at the edges.

Affiliated with

Also associated with

Rating

Metallic laminations for magnetic circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallic laminations for magnetic circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallic laminations for magnetic circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1715095