Metallic material for electronic components, method of...

C - Chemistry – Metallurgy – 22 – C

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C22C 9/00 (2006.01) C23C 14/34 (2006.01) H01L 21/3205 (2006.01) H01L 21/3213 (2006.01) H01L 23/52 (2006.01)

Patent

CA 2670068

The metallic material consists of an alloy including mainly Cu, Mo in an amount of 0.1 to 3.0% by weight and one or a plurality of elements selected from a group consisting of Al, Au, Ag, Ti, Ni Co and Si in a total amount of 0. 1 to 3. 0% by weight. In the metallic material, Mo is added to Cu so that Mo will be homogeneously mixed in a grain boundary of Cu, resulting in improvement of atmospheric corrosion resistance.

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