Metallization of non-conductors

Details Metallization of non-conductors Metallization of non-conductors

C - Chemistry, Metallurgy

25

D

C25D 5/56 (2006.01) C08G 61/12 (2006.01) C25D 5/54 (2006.01) H05K 3/42 (2006.01)

Patent

CA 2069865

The invention provides a process for enabling direct metallization of nonconductors. Strongly-adherent insoluble polymeric products are deposited in one process step on the surface of the nonconductor from an acidic aqueous solution (optionally containing a solubilizer) of initially-nonconductive oligomers, monomer/oligomer mixtures, or monomers or mixtures of monomers of five-membered heterocycles, by contact with a non-rinsable insoluble coating containing manganese dioxide which has been adsorbed on the surfaces of the nonconductor from a solution containing permanganates. The electrical conductance of the polymeric products is sufficient to permit deposition of metal on the polymer surface from galvanic baths through application of an electrical current.

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