Metallized bag with improved interlayer adhesion for static...

Details Metallized bag with improved interlayer adhesion for static... Metallized bag with improved interlayer adhesion for static...

H - Electricity

05

F

190/150, 317/3,

H05F 1/00 (2006.01) B32B 15/08 (2006.01) B65D 65/40 (2006.01) H05F 3/00 (2006.01) H05K 9/00 (2006.01)

Patent

CA 2029566

Abstract of the Disclosure A flexible sheet material and bags made therefrom for packaging electrostatically sensitive items such as elec- tronic circuit boards. The sheet has a metal layer that is adhesively laminated to an antistatic polymeric layer, the instant bags being of improved metal layer to antistatic layer adhesion. The metal outer surface of the bag has a high non-conductive surface resistivity greater than or equal to 108 ohms/square, yet the bag protects the packaged item from static voltage by preventing the capacitive coupling of the voltage through the bag to the item packaged therein. 5/900222.3A/TXTJLS 10/23/90

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