Metallized ceramic and printed circuit module

Details Metallized ceramic and printed circuit module Metallized ceramic and printed circuit module

H - Electricity

05

K

356/5

H05K 1/14 (2006.01) H05K 3/34 (2006.01) H05K 3/36 (2006.01)

Patent

CA 1079862

METALLIZED CERAMIC AND PRINTED CIRCUIT MODULE ABSTRACT OF THE DISCLOSURE A package assembly which combines metallized ceramic technology and printed circuit board multilayer technology. A plurality of modules on a metallized ceramic substrate have closely spaced pins, for example, on 50 mil centers or grid, are plugged into a complex high precision multilayer printed circuit carrier. The pins are staggered in height with the longer pins having a relatively wide spacing, for example, on 100 mil centers or grid. The longer pins protrude through the high precision carrier and plug into a normal relatively simple and low cost printed circuit card or planar package.

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