C - Chemistry – Metallurgy – 04 – B
Patent
C - Chemistry, Metallurgy
04
B
C04B 41/51 (2006.01) C04B 41/52 (2006.01) C04B 41/89 (2006.01)
Patent
CA 2154833
A metallized ceramic substrate having a smooth plating layer, comprising a ceramic substrate comprising aluminum nitride as a main component; a tungsten- and/or molybdenum-based metallized layer formed on at least one face of the ceramic substrate and a nickel-based plating layer which is formed on the metallized layer and has a thickness of not greater than 2 µm and a surface roughness (Ra) of not greater than 2 µm. In another aspect, the plating layer may be constituted of a first nickel-based plating layer and a second gold-based plating layer in which the first plating layer and the second plating layer have a thickness of not greater than 2 µm and a thickness of not greater than 1 µm, respectively, and the surface roughness (Ra) of the second layer should be 2 µm or less. These metallized substrates are produced by applying a metallizing paste of W and/or Mo onto a green A1N ceramic substrate, flattening, firing and forming the foregoing plating layer or layers.
Nakata Hirohiko
Shimoda Kouhei
Goudreau Gage Dubuc
Sumitomo Electric Industries Ltd.
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