Metallized multilayer film

B - Operations – Transporting – 32 – B

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B32B 15/08 (2006.01) B32B 27/08 (2006.01) B32B 27/30 (2006.01) B44C 1/14 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2042995

METALLIZED MULTILAYER FILM ABSTRACT OF THE DISCLOSURE A metallized multilayer film comprising a first substrate layer, a second substrate layer, and a layer of metal. The first substrate layer comprises from 0 to about 40 parts by weight poly(vinylidine fluoride) and, correspondingly, from 100 to about 60 parts by weight poly(methyl methacrylate). The second substrate layer comprises from about 70 to 100 parts by weight poly(vinylidine fluoride) and, correspondingly, from about 30 to 0 parts by weight poly(methyl methacrylate).

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