C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
117/90, 204/91.4
C23C 14/20 (2006.01) B05D 7/24 (2006.01) C08J 7/04 (2006.01)
Patent
CA 1072045
ABSTRACT OF THE DISCLOSURE A metallized plastic molding comprises a plastic substrate, a primer layer having a gel percentage of at least 80% and a swelling degree of 20% or less deposited on said substrate and a metallic film deposited on the primer layer. The metallized plastic molding is pre- pared by coating a plastic substrate with a primer forming material con- taining at least one compound having a molecular weight of 150 - 2000 and containing at least two polymerizable unsaturated groups in one molecule, curing the primer forming material so that it has a gel per- centage of at least 80% and a swelling degree of 20% or less to form a primer layer and then depositing a metallic film layer by a dry type method on the primer layer.
280195
Kobayashi Juichi
Miyakawa Norio
Satoh Mitsuo
Mitsubishi Rayon Company Ltd.
Na
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