Metallized polymers

C - Chemistry – Metallurgy – 23 – C

Patent

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117/240, 117/77

C23C 18/52 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1266592

ABSTRACT OF THE DISCLOSURE Formation of well-adhered metal layers on aromatic polymeric substrates through a two-step process is based upon reversible charge storage in the electroactive center- containing polymeric substrate. Articles particularly useful for electronic, imaging and solar applications are produced. The process disclosed may be a totally additive process such that articles can be produced in a continuous manner.

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