Metallized substrate for electronic device

Details Metallized substrate for electronic device Metallized substrate for electronic device

H - Electricity

01

L

31/183, 356/3

H01L 23/498 (2006.01) B32B 18/00 (2006.01) C03C 10/00 (2006.01) H01L 21/48 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1337376

Metallizing pastes, for forming thick film circuitry on low expansion substrates in electronic devices, are disclosed. The paste contains a glass powder that crystal- lizes on firing to a glass-ceramic in which lead titanate is the primary crystal phase.

610720

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