C - Chemistry – Metallurgy – 07 – F
Patent
C - Chemistry, Metallurgy
07
F
167/119, 260/429
C07F 15/06 (2006.01) A61K 31/295 (2006.01) A61K 31/555 (2006.01)
Patent
CA 2004534
The present invention provides a complex compound having the structure: Image wherein R1 and R1' are the same or different and each is an alkyl group, a phenyl group or a substituted derivative of a phenyl group; wherein R2 and R2' are the same or different and each is hydrogen, an unbranched alkyl group, a halide or a group having the structure Image wherein R is hydrogen, an alkoxide group, an alkyl group, or OH; wherein R3 and R3' are the same or different and each is hydrogen or an alkyl group; wherein X and X' are the same or different and each is a water soluble group having weak to intermediate ligand field strength; and Q is a soluble, pharmaceutically acceptable negative ion. The invention also provides a method of treating a subject having a condition associated with the presence of free radicals in quantities sufficient to cause undesirable symptoms. A method of treating a wound or a burn and a method for treating a subject afflicted with tumor cells so as to cause regression of the tumor cells are also provided. These methods involve administering to the subject (or topically administering to the burn or wound) an effective amount of the compound. Furthermore the invention provides pharmaceutical compositions for the treatment of tumor cells in a subject or for the treating of undesirable symptoms associated with the presence of free radicals. The compositions comprising an effective amount of the compound and a pharmaceutically acceptable carrier. Also provided is an antimicrobial composition which comprises a suitable carrier and the compound in an amount effective to suppress the growth of microorganisms.
Dori Zvi
Gershon David
Chai-Tech Corporation
Kirby Eades Gale Baker
LandOfFree
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