Metering of adhesive for coating chips, fibers and the like...

B - Operations – Transporting – 27 – N

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

32/4, 117/46.3

B27N 1/02 (2006.01)

Patent

CA 1156518

ABSTRACT OF THE DISCLOSURE A system for metering binders for application of adhesives to chips, fibers and the like for manufacture of composite panels, has a supply vessel, a withdrawal pump with a drive and a control loop for speed control of the withdrawal pump. A filler pump fills a first measuring cup with adhesive through a supply line. After complete filling the cup is connected with a suction connection of the withdrawal pump and simultaneously a connection is effected between the supply line with a second measuring cup. The emptying time of the measuring cups is sensed and compared as actual emptying time with a command emptying time which is determined based on the desired volume of adhesive per unit time. Upon exceeding of the command emptying time, the throughput rate of the withdrawal pump is increased and upon falling below of the command emptying time, the throughput rate is decreased.

377359

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Metering of adhesive for coating chips, fibers and the like... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metering of adhesive for coating chips, fibers and the like..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metering of adhesive for coating chips, fibers and the like... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-167340

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.