H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/113
H01L 23/34 (2006.01) H01L 23/433 (2006.01)
Patent
CA 2003403
METHOD AND APPARATUS FOR ADJUSTABLY MOUNTING A HEAT EXCHANGER FOR AN ELECTRONIC COMPONENT Abstract of the Disclosure A fluid heat exchanger for mating with an electronic component is supported from a fixed support. A connection between the fixed support and the heat exchanger is initially flexible for adjusting the position of the heat exchanger to accommodate variations in the height or attitude of the electronic component for providing a good thermal interface. Thereafter, the connection changes to a rigid connection to provide good structural support for the heat exchanger which allows the support to withstand vibration or shock without overloading the electronic component. The flexibility of the connection may be reversible for later readjusting the position of the heat exchanger relative to the electronic component.
Gupta Omkarnath R.
Herrell Dennis J.
Nelson Richard D.
Borden Ladner Gervais Llp
Gupta Omkarnath R.
Herrell Dennis J.
Microelectronics And Computer Technology Corporation
Nelson Richard D.
LandOfFree
Method and apparatus for adjustably mounting a heat... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for adjustably mounting a heat..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for adjustably mounting a heat... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1846649