Method and apparatus for aligning and attaching a surface...

Details Method and apparatus for aligning and attaching a surface... Method and apparatus for aligning and attaching a surface...

H - Electricity

05

K

H05K 1/18 (2006.01) B23K 1/00 (2006.01) H05K 1/11 (2006.01) H05K 3/34 (2006.01) H05K 13/04 (2006.01)

Patent

CA 2117404

A method and an apparatus align and attach a leadless surface mount component (402) including a termination at each end of the component (402). The termination has bottom (704) and end (702) portions for attaching to a corresponding pad on a substrate (102) by a reflow solder process (1200). A pad arrangement (100) is formed including two opposite pads (108), each pad (108) occupying a tri-oval-shaped area. The tri-oval-shaped area includes an elliptical area (110) substantially centered under the bottom portion (704) of the corresponding termination of the component (402) when the component (402) is aligned with the pad arrangement (100), and an arcuate area (112) contiguous with the elliptical area (110) and extending towards the opposite pad (108) in a central lengthwise direction. A solder paste (202) is applied to the elliptical area (110), and thereafter reflowed, whereby solder (302) in the solder paste (202) liquefies and flows onto the arcuate area (112), thereby facilitating alignment of the component (402) with the pad arrangement (100).

Affiliated with

Also associated with

Rating

Method and apparatus for aligning and attaching a surface... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for aligning and attaching a surface..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for aligning and attaching a surface... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1424356