Method and apparatus for applying a layer of a fluid...

Details Method and apparatus for applying a layer of a fluid... Method and apparatus for applying a layer of a fluid...

B - Operations, Transporting

05

D

356/147, 32/27,

B05D 1/26 (2006.01) B05C 5/02 (2006.01) B05C 11/08 (2006.01) G03F 7/16 (2006.01) H01L 21/47 (2006.01) H05K 3/02 (2006.01)

Patent

CA 2039879

ABSTRACT An apparatus and method for applying a uniform layer of a fluid material such as photoresist onto the surface of a rotating workpiece (104) such as a semiconductor wafer. A dispensing nozzle (114) is provided with a rectangular or narrow elongated shaped opening (124) for painting a broad swath of the fluid material onto the surface of the workpiece (104) while the nozzle (124) moves along a radial path (130) inwardly from the peripheral edge of the workpiece (104). Fig. 1.

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